Huawei Claims Breakthrough Roadmap to Narrow Gap with TSMC in Advanced Chips

Huawei Technologies Co. said it has developed a new pathway to narrow its gap with industry leader Taiwan Semiconductor Manufacturing Co. (TSMC), potentially achieving a breakthrough in advanced semiconductor production without relying on cutting-edge lithography equipment, Bloomberg News reported.

Huawei is actively developing domestic semiconductor alternatives due to U.S. export restrictions. (Photo: Huawei)

The company currently faces an estimated five-year gap between its chip manufacturing capabilities (through partner Semiconductor Manufacturing International Corp., or SMIC) and those of TSMC.

Huawei said it aims to begin producing 1.4-nanometer chips by 2031 using its proprietary “LogicFolding” technology, according to Huawei semiconductor chief He Tingbo, who spoke at a chip conference held recently.

TSMC, meanwhile, has indicated it expects to begin mass production of similar-generation chips around 2028.

He described the approach as “sustainable evolution,” and told reporters that Huawei’s roadmap could significantly advance its chip design and manufacturing capabilities without relying on ASML Holding NV’s extreme ultraviolet (EUV) lithography machines, which are widely considered essential for leading-edge semiconductor production.

Huawei said its upcoming Kirin mobile chips, expected this fall, will be the first to use the LogicFolding architecture, designed to increase transistor density and improve data.